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Design tools for device developers [START] Interface

Interface covering the electronic device manufacturing environment.

You can consolidate device data from different manufacturing processes onto the same sheet. Devices with significantly different unit systems can also be synthesized. You can smoothly import and match different data components (such as polygon patterns, width lines, custom pads, etc.). This can be utilized for collaboration between LSI chips, packages, and boards. ■ You can synthesize heterogeneous device data to check for interference and connections. ⇒ An M-netlist (connection network of the entire synthesized module) can be output. ■ You can design, edit, and inspect on the same data from nano/micron wiring to millimeter/meter range. Additionally, there are the following use cases: ◆ It can also be used as a support tool for wiring patterns in semiconductor systems. ⇒ RDL wiring/TEG evaluation patterns ◆ Input and output of general-purpose mechanical drawings (DXF) is also possible. ◆ Examples of composite module adoption: 3D image sensor module (ASET) Ultra-wide bus memory 3D-SiP (ASET) Optical electronics packaging system technology development (PETRA) *For more details, please refer to the catalog available for download below.

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• 2D CAD Electrical